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VCUniform heating plateyesVapor ChamberThe abbreviation, full name is: Vacuum chamber heat dissipation plate technology. Widely used in electronic devices,Electronic components,New energy vehicles,industrial production,Thermal management in different fields such as household appliances and military，Especially in the mobile phone industry, applications are more common.early stagehandmachinedissipate heatGraphite is commonly used as the main material, which can be referred to as the first generation of heat dissipation，Copper tube liquid cooling is the second-generation heat dissipation technology, andVCUniform heating plateIt is the latest third-generation heat dissipation technology.

The principle of a heat pipe is well known to everyone. The inner wall of the heat pipe is a layer of capillary structure, which is filled with liquid and evacuated. The device installed at the heat source end is called the evaporation end. When heat is released, the liquid inside the evaporation end vaporizes and transfers to the lower pressure condensation end, where it is cooled and condensed into water. From this process, heat pipes andVCIt seems to be the same thing.

VCLiquid cooling can be seen as a dimension enhancement technology for copper tube liquid cooling,hisThe working principle is similar to that of a heat pipe, both of which are completed in a vacuum chamber, conducting heat through liquid evaporation and flow. The difference is that the heat transfer path of a heat pipe is one-dimensional and the transfer direction is single. The heat transfer path of the uniform heat plate is two-dimensional, and heat can be conducted in multiple horizontal directions, resulting in higher efficiency.

machineThe heat generated during operation is conducted to the evaporation end of the heat equalizing plate, and the internal cooling liquid quickly absorbs this heat and vaporizes into steam. At this time, the steam rapidly expands due to the absorption of heat and moves from the high-pressure area to the low-pressure area in the heat equalizing plate. During the movement of the steam to the low-pressure area, it quickly condenses when it comes into contact with the lower temperature inner wall, releases heat, and liquefies into liquid, which flows back to the evaporation end through the capillary action of the inner wall of the chamber. In short, it is a circulating heat dissipation system in which the cooling liquid in the heat equalizing plate constantly switches back and forth between liquid and gas.

relativelyheat pipecontrastfor,VCUniformly heated plateMore efficient heat dissipationHigh, the application on high-end mobile phones is becoming increasingly widespread, even including heat pipesMobile VCUniform heating plate The three-dimensional heat dissipation forms of multi-layer graphite are constantly emerging.